教育经历
- 2008年-2012年，华东理工大学 学士
- 2013年-2015年，威廉体育williamhill官网 硕士
- 2015年-2018年，早稻田大学 博士
工作经历
- 2017年-2018年，日本学术振兴会JSPS特别研究员，
- 2018年-2021年，williamhill威廉希尔官网，助理教授
- 2022年-至今，上海williamhill威廉希尔官网，副教授
研究方向
- 集成电路互连材料
- 三维电子封装技术
论文信息
- 1. X Ren, G Chen, P Chang, S Ju, Y Wu*，Crystal plane shielding and D-band modulation synergistically achieve durable (100) textured zinc anodes, Energy & Environmental Science, 2025, 18, 1867-1878.
- 2. X Jin, H Li, Y Sun, Z Chen, P Chen, H Su, M Li, Y Wu*, Enhanced Reliability of Cu-Sn Bonding through the Microstructure Evolution of Nanotwinned Copper, Acta Materialia, 2025, 283, 120524.
- 3. P Chen, W Shen, Z Chen, C Li, S Han, Y Wu*, T Hang*, M Li, Surface Atom Migration-involved Two-dimensional Nucleation and Growth of Nanotwinned Copper in DC Electrodeposition, Acta Materialia, 2023, 262, 119468.
- 4. P Chen, C Li, S Han, T Hang, H Ling, Y Wu*, M Li, Abnormal grain growth of (110)-oriented perpendicular nanotwinned copper into ultra-large grains at low temperatures, Journal of Materials Science & Technology, 2024, 203, 61–65.
- 5. X Jin, X Ren, G Cui, S Ju, T Hang, M Li, Y Wu*, Unveiling electron scattering mechanism at Al-doped grain boundaries in Cu interconnects, Materials & Design, 2025, 251, 113677.
- 6. H Li, Z Liang, Z Ning, Z Liu*, M Li, Y Wu*, Low-temperature Cu-Cu direct bonding with ultra-large grains using highly (110)-oriented nanotwinned copper, Materials Characterization, 2024, 217, 114455.
- 7. G Chen, D Zhang, X Ren, M Zhang, S Ju*, Y Wu*, Saturation absorbed sodium benzenesulfonate as crystallization modulating additive for dendrite-free Zn anode, Chemical Engineering Journal, 2024, 156868.
- 8. L Shu, C Li, Y Wu*, T Hang, L Liu, M Li*, The influence of sub-surface damage microstructure on ultra-thin die flexural strength, Journal of Materials Research and Technology, 2024, 31, 3790-3800.
- 9. M Zhang, P Chang, P Chen, T Hang, M Li, Y Wu*, Super-flat and uni-oriented cobalt film electrodeposited by modulating the crystal nucleation and growth behavior, Applied Surface Science, 2023, 158795.（一区，唯一通讯作者）
- 10. Z Zhou, Y Wu*, H Ling, J Guo, S Wang, M Li, Redeposition mechanism on silicon oxide layers during selective etching process in 3D NAND manufacture, Journal of Industrial and Engineering Chemistry, 2023, 119, 218-225.
- 11. X Huang, S Ma, Y Wu*, C Wan, CY Zhao, H Wang, S Ju*, High-throughput screening of amorphous polymers with high intrinsic thermal conductivity via automated physical feature engineering, Journal of Materials Chemistry A, 2023, 11 (38), 20539-20548.
- 12. Y Wu, T Hang, H Ling, A Hu, M Li*. Review on the electrodeposition and properties of high-density chip interconnection. Sci Sin Chim, 2023, 53: 1835 1852.
- 13. Z Chen, P Chen, Y Sun, T Hang, H Su, K Lou, M Li, Y Wu*, Improved Cu/Sn interface reliability using double-layer stacked nano-twinned Cu, Materials Characterization, 2023, 205, 113269.
- 14. 19. W Hu, S Ju*, X Huang, F Li, M Li, Y Wu*, Promote Stable Lithium Deposition by Curvature Optimization Using Lithiophilic Ni Nano-starfish@Al Structured Current Collector, Advanced Sustainable Systems, 2023, 7 (11), 2300229.
- 15. L Cao, Y Zheng, Q Xue, Z Wen, L Chen, Y Huang, T Hang, Y Wu*, M Li*, Covalent Grafting of PMMA Organic Film on Porous Silicon for Achieving Ultralow-k Organic Films, ACS Applied Electronic Materials, 2022, 4 (12), 6047-6057.
社会兼职
- 电子材料与技术研究所
- 电子材料与技术研究所
- 电子材料与技术研究所
荣誉信息
- 威廉体育williamhill官网优秀团员
- 2024年 第四届上海市高校教师教学创新大赛二等奖
- 2024年 威廉体育williamhill官网教书育人奖三等奖
- 2023年 中国表面工程协会科学技术贡献奖‘科研之星’
- 中表镀-安美特优秀教师奖
- 威廉体育williamhill官网优秀团员
- 上海市青年科技英才扬帆计划
- 日本学术振兴会研究奖励金
- 上海市优秀毕业生